🌍✨ Infineon’s ENDOPACK Cell embeds 1,200 V SiC MOSFETs in traction inverter PCBs
Why we’re watching: Infineon Technologies has introduced ENDOPACK Cell, which embeds its 1,200 V Automotive Gen2p CoolSiC MOSFETs directly in a printed circuit board (PCB).
ENDOPACK Cell is designed to help automakers develop traction inverters faster and scale them across vehicle platforms. 💚
ENDOPACK is Infineon's new brand for chip-embedding technologies in a range of voltage classes, form factors and applications.
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🔭 What to watch next
- 📌 Key signal: Infineon Technologies has introduced ENDOPACK Cell, which embeds its 1,200 V Automotive Gen2p CoolSiC MOSFETs directly in a printed circuit board (PCB).…
- ✅ Watch for measurable follow-through, not just announcements.
- 🔎 Share the most practical takeaway with your community.
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Reporting curated for GreenTV. Original reporting via Charged EVs.
